何宗漢 教授
- 系所：化學工程與材料工程系
- 研發領域：化學工程及製程
- 標籤： 材料科技,無機材料,高分子材料,環境科技,化工製程
- 專長： 電子用高分子材料,高分子合成與物性,半導體封裝材料
- 學歷：
國立成功大學化工博士
- 經歷：
台灣玻璃公司溶解控制室領班2年
- 電話：(07)381-4526 #15125
- 傳真：(07)383-0674
1
碳纖維長度對團狀模塑料機械性質之影響Influences of Carbon Fiber Length on Bulk Moulding Compound Mechanical Properties
2
以間苯二甲胺為鏈延長劑合成低黏度、高穩定性水性聚氨酯之製備與其物性之研究Preparation and properties of low-viscosity, high stability waterborne polyurethane by m-xylylenediamine as chain extender
3
含酯基團液晶環氧樹脂/含DOPO硬化劑之合成、鑑定及其物理性質之研究Preparation and Properties of Liquid Crystalline Epoxy Resin Containing Ester Group and Curing Agent Based on DOPO
4
藉不同的封裝材與釘架粗糙度改善IC構裝體的脫層現象Improving the Delamination of IC Packages by Different Encapsulants and Lead-Frame Roughness
5
導熱膠和黏著劑對大尺寸封裝製程之影響The Influences of Thermal Interface Materials (TIMs) and Adhesives on Assembly Process for Large Packages
6
無導電線IC載板賈凡尼效應之研究A Study on Galvanic Corrosion of Non-Plating-Line IC Substrate
7
不同防焊材料與覆蓋率於內埋線路無核心基板對銅柱覆晶構裝之翹曲評估The Warpage Evaluation through Different Solder Resist Materials and Coverage of Trace-Embedded Coreless Substrate for Cu Pillar-Flip Chip Package
8
吸除研磨有效避免金屬離子擴散應用於研磨至150μm以下含記憶功能之凸塊晶圓Gettering grinding apply on bump wafer which thinner than 150 μm and with memory function to avoid metal diffusion effectively
9
含Azine液晶環氧樹脂/含酯基液晶硬化劑之製備及其熱性質研究Preparation and Thermal Properties of Liquid Crystalline Epoxy Resin Containing Azine Mesogen and The Liquid Crystalline Curing Agent Bearing Ester Group
10
兩性離子抗靜電劑的添加對光固化樹脂在3D列印應用的影響Effects of Zwitterionic Antistatic Liguids Addition on 3D Printing UV Curing Resin
11
無溶劑、低黏度、高固形份水性聚氨酯之製備及其物性之研究Preparation and Properties of Solvent-free, Low-viscosity and High-solid Content Waterborne Polyurethane
12
IC盤用聚氧化二甲苯複合材料之製備及其物性研究Preparation and physical properties of polyphenylene oxide composites for IC tray application
13
化學浸泡去膠製程對四方平坦外露晶片座構裝產品(QFP)脫層之研究The Study of Chemical Dipping De-flash Process on Exposed Die Paddle Delamination for Quad Flat Package (QFP)
14
化學浸泡除膠劑SHD302K對正面溢膠之可行性與可靠度測試分析Feasibility and Reliability Test Analysis of Chemical Dipping De-flash SHD-302K for Top Side Mold Flash